A W-Band chip-to-printed circuit board interconnect

Publikationstyp
Conference Paper
Date Issued
2020-08
Sprache
English
Author(s)
Deutschmann, Björn 
Jacob, Arne  
Institut
Hochfrequenztechnik E-3  
TORE-URI
http://hdl.handle.net/11420/7786
Journal
IEEE MTT-S International Microwave Symposium digest  
Volume
2020-August
Start Page
1039
End Page
1042
Article Number
9223815
Citation
IEEE MTT-S International Microwave Symposium: 9223815 (2020-08)
Contribution to Conference
IEEE MTT-S International Microwave Symposium, 2020  
Publisher DOI
10.1109/IMS30576.2020.9223815
Scopus ID
2-s2.0-85094210549
An alternative to wire-bonding and flip-chip interconnects of integrated circuits and printed circuit boards (PCB) is presented. The flip-line interconnect combines the advantages of wire-bonding and flip-chip technology while avoiding their disadvantages. It is especially useful for prototype setups where device inspection and repairability are crucial. The proposed structure is analyzed using full-wave simulation software. It is shown, that in contrast to wire-bonding, the transition length is not critical. A transition from a CMOS chip with a pad pitch of 100 μm to a regular PCB is manufactured. Measurements at W-band (75-110 GHz) reveal a return loss better than 12 dB and transmission above -3.4 dB.
Subjects
Flip-chip
Interconnect
W-band
Wire-bonding