DC FieldValueLanguage
dc.contributor.authorLipka, Timo-
dc.contributor.authorMoldenhauer, Lennart-
dc.contributor.authorMüller, Jörg-
dc.contributor.authorTrieu, Hoc Khiem-
dc.date.accessioned2020-03-26T12:32:37Z-
dc.date.available2020-03-26T12:32:37Z-
dc.date.issued2016-05-11-
dc.identifier.citationPhotonics Research 3 (4): 126-134 (2016-06-01)de_DE
dc.identifier.issn2327-9125de_DE
dc.identifier.urihttp://hdl.handle.net/11420/5516-
dc.description.abstractWe present integrated-optic building blocks and functional photonic devices based on amorphous silicon-on-insulator technology. Efficient deep-etched fiber-to-chip grating couplers, low-loss single-mode photonic wire waveguides, and compact power splitters are presented. Based on the sub-μm photonic wires, 2 × 2 Mach-Zehnder interferometers and add/drop microring resonators (MRRs) with low device footprints and high finesse up to 200 were realized and studied. Compact polarization rotators and splitters with ≥10 dB polarization extinction ratio were fabricated for the polarization management on-chip. The tuning and trimming capabilities of the material platform are demonstrated with efficient microheaters and a permanent device trimming method, which enabled the realization of energy-efficient photonic circuits. Wavelength multiplexers in the form of cascaded filter banks and 4 × 4 routers based on MRR switches are presented. Fabrication imperfections were analyzed and permanently corrected by an accurate laser-trimming method, thus enabling eight-channel multiplexers with record low metrics of sub-mW static power consumption and ≤1°C temperature overhead. The high quality of the functional devices, the high tuning efficiency, and the excellent trimming capabilities demonstrate the potential to realize low-cost, densely integrated, and ultralow-power 3D-stacked photonic circuits on top of CMOS microelectronics.en
dc.description.sponsorshipSupported by DFG and TUHH in the funding programme Open Access Publishing.de_DE
dc.language.isoende_DE
dc.publisherOSAde_DE
dc.relation.ispartofPhotonics researchde_DE
dc.subject.ddc600: Technikde_DE
dc.titlePhotonic integrated circuit components based on amorphous silicon-on-insulator technologyde_DE
dc.typeArticlede_DE
dc.type.diniarticle-
dcterms.DCMITypeText-
tuhh.abstract.englishWe present integrated-optic building blocks and functional photonic devices based on amorphous silicon-on-insulator technology. Efficient deep-etched fiber-to-chip grating couplers, low-loss single-mode photonic wire waveguides, and compact power splitters are presented. Based on the sub-μm photonic wires, 2 × 2 Mach-Zehnder interferometers and add/drop microring resonators (MRRs) with low device footprints and high finesse up to 200 were realized and studied. Compact polarization rotators and splitters with ≥10 dB polarization extinction ratio were fabricated for the polarization management on-chip. The tuning and trimming capabilities of the material platform are demonstrated with efficient microheaters and a permanent device trimming method, which enabled the realization of energy-efficient photonic circuits. Wavelength multiplexers in the form of cascaded filter banks and 4 × 4 routers based on MRR switches are presented. Fabrication imperfections were analyzed and permanently corrected by an accurate laser-trimming method, thus enabling eight-channel multiplexers with record low metrics of sub-mW static power consumption and ≤1°C temperature overhead. The high quality of the functional devices, the high tuning efficiency, and the excellent trimming capabilities demonstrate the potential to realize low-cost, densely integrated, and ultralow-power 3D-stacked photonic circuits on top of CMOS microelectronics.de_DE
tuhh.publisher.doi10.1364/PRJ.4.000126-
tuhh.publication.instituteMikrosystemtechnik E-7de_DE
tuhh.type.opus(wissenschaftlicher) Artikel-
dc.type.driverarticle-
dc.type.casraiJournal Article-
tuhh.container.issue3de_DE
tuhh.container.volume4de_DE
tuhh.container.startpage126de_DE
tuhh.container.endpage134de_DE
local.status.inpressfalsede_DE
item.cerifentitytypePublications-
item.openairecristypehttp://purl.org/coar/resource_type/c_6501-
item.fulltextNo Fulltext-
item.creatorOrcidLipka, Timo-
item.creatorOrcidMoldenhauer, Lennart-
item.creatorOrcidMüller, Jörg-
item.creatorOrcidTrieu, Hoc Khiem-
item.openairetypeArticle-
item.languageiso639-1en-
item.creatorGNDLipka, Timo-
item.creatorGNDMoldenhauer, Lennart-
item.creatorGNDMüller, Jörg-
item.creatorGNDTrieu, Hoc Khiem-
item.grantfulltextnone-
crisitem.author.deptMikrosystemtechnik E-7-
crisitem.author.deptMikrosystemtechnik E-7-
crisitem.author.deptMikrosystemtechnik E-7-
crisitem.author.deptMikrosystemtechnik E-7-
crisitem.author.orcid0000-0003-4942-1669-
crisitem.author.parentorgStudiendekanat Elektrotechnik, Informatik und Mathematik-
crisitem.author.parentorgStudiendekanat Elektrotechnik, Informatik und Mathematik-
crisitem.author.parentorgStudiendekanat Elektrotechnik, Informatik und Mathematik-
crisitem.author.parentorgStudiendekanat Elektrotechnik, Informatik und Mathematik-
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