Publisher DOI: 10.1109/IMS30576.2020.9223815
Title: A W-Band chip-to-printed circuit board interconnect
Language: English
Authors: Deutschmann, Björn 
Jacob, Arne 
Keywords: Flip-chip; Interconnect; W-band; Wire-bonding
Issue Date: Aug-2020
Source: IEEE MTT-S International Microwave Symposium: 9223815 (2020-08)
Abstract (english): 
An alternative to wire-bonding and flip-chip interconnects of integrated circuits and printed circuit boards (PCB) is presented. The flip-line interconnect combines the advantages of wire-bonding and flip-chip technology while avoiding their disadvantages. It is especially useful for prototype setups where device inspection and repairability are crucial. The proposed structure is analyzed using full-wave simulation software. It is shown, that in contrast to wire-bonding, the transition length is not critical. A transition from a CMOS chip with a pad pitch of 100 μm to a regular PCB is manufactured. Measurements at W-band (75-110 GHz) reveal a return loss better than 12 dB and transmission above -3.4 dB.
Conference: IEEE MTT-S International Microwave Symposium, 2020 
ISBN: 978-172816815-9
ISSN: 0149-645X
Journal: IEEE MTT-S International Microwave Symposium digest 
Institute: Hochfrequenztechnik E-3 
Document Type: Chapter/Article (Proceedings)
Project: Voll integrierter dual polarisierter Gruppenstrahler mit ultrabreitbandigem Ein-Chip-CMOS-Empfänger (DataRace)/Drahtlose Ultrahochgeschwindigkeitskommunikation für den mobilen Internetzugriff - DataRace 
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