Publisher DOI: | 10.1109/IMS30576.2020.9223815 | Title: | A W-Band chip-to-printed circuit board interconnect | Language: | English | Authors: | Deutschmann, Björn Jacob, Arne |
Keywords: | Flip-chip; Interconnect; W-band; Wire-bonding | Issue Date: | Aug-2020 | Source: | IEEE MTT-S International Microwave Symposium: 9223815 (2020-08) | Abstract (english): | An alternative to wire-bonding and flip-chip interconnects of integrated circuits and printed circuit boards (PCB) is presented. The flip-line interconnect combines the advantages of wire-bonding and flip-chip technology while avoiding their disadvantages. It is especially useful for prototype setups where device inspection and repairability are crucial. The proposed structure is analyzed using full-wave simulation software. It is shown, that in contrast to wire-bonding, the transition length is not critical. A transition from a CMOS chip with a pad pitch of 100 μm to a regular PCB is manufactured. Measurements at W-band (75-110 GHz) reveal a return loss better than 12 dB and transmission above -3.4 dB. |
Conference: | IEEE MTT-S International Microwave Symposium, 2020 | URI: | http://hdl.handle.net/11420/7786 | ISBN: | 978-172816815-9 | ISSN: | 0149-645X | Journal: | IEEE MTT-S International Microwave Symposium digest | Institute: | Hochfrequenztechnik E-3 | Document Type: | Chapter/Article (Proceedings) | Project: | Voll integrierter dual polarisierter Gruppenstrahler mit ultrabreitbandigem Ein-Chip-CMOS-Empfänger (DataRace)/Drahtlose Ultrahochgeschwindigkeitskommunikation für den mobilen Internetzugriff - DataRace |
Appears in Collections: | Publications without fulltext |
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