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    Item type:Publication, Access status: without files ,
    An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair
    (IEEE, 2015-01-26)
    Zhang, Yao Jiang
    ;
    Ren, Liehui
    ;
    Liu, Dazhao
    ;
    De, Soumya
    ;
    Gu, Xiaoxiong
    A hybrid 3-D and equivalent 2-D finite-element method (FEM) is proposed for signal/power integrity analysis of multiple vias in a shared anti-pad in an arbitrarily shaped parallel-plate pair. The entire domain of the plate pair is decomposed into via-domains and plate domains by virtual interfaces. Complicated fields in via-domains, due to mode conversions from transverse electromagnetic modes in anti-pads or via-holes to parallel-plate modes, are described by a 3-D FEM while in plate domains, only the zeroth-order parallel-plate modes are assumed to exist a little far away from anti-pads. Triangular prism elements are utilized in both via-domains and plate domains. It is proven that the 3-D triangular prism element can be reduced to an equivalent 2-D triangle element by a novel edge numbering process and the boundary conditions along the interfaces of via-domains and plate domains can be automatically satisfied. The accuracy of the hybrid method has been validated by comparison with other numerical methods, and its flexibility, as well as efficiency, are also demonstrated.
    Publicationtype: Journal Article
      52
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    Item type:Publication, Access status: without files ,
    Validation and application of physics-based via models to dense via arrays
    (Curran Associates, Inc., 2011)
    Gu, Xiaoxiong
    ;
    Kwark, Young Hoon
    ;
    Zhang, Yao Jiang
    ;
    Fan, Jun
    ;
    Ruehli, Albert
    Fast and accurate via models are required to analyze dense via arrays on printed circuit boards with pitches up to 1mm. Fundamentals of physics-based via models are reviewed and their advantages over general-purpose electromagnetic field solvers are discussed. Recent studies extend the models to take into account multiple scattering among vias. This paper also analyzes if anisotropic field distribution on via holes, and boundary reflection due to the finite size of power planes play a role for high speed digital designs. The updated via models are validated by hardware measurement and 3D full-wave simulations.
    Publicationtype: Conference Paper
      36