DC FieldValueLanguage
dc.contributor.authorDeutschmann, Björn-
dc.contributor.authorJacob, Arne-
dc.date.accessioned2019-03-13T11:51:24Z-
dc.date.available2019-03-13T11:51:24Z-
dc.date.issued2018-11-20-
dc.identifier.citation2018 48th European Microwave Conference, EuMC 2018: 620-623 (2018-11-20)de_DE
dc.identifier.isbn978-287487051-4de_DE
dc.identifier.urihttp://hdl.handle.net/11420/2117-
dc.description.abstract© 2018 European Microwave Association. This paper describes the development of ultra-broadband compact power dividers for the frequency range from 2 to 40 GHz. A multi-section approach with reduced line lengths of the successive sections is used to achieve this large bandwidth at a minimal size. The resistors needed for an acceptable isolation are manufactured by lithographically structuring a conductive paste on top of microstrip lines. Thus, the entire device is planar and enables the integration in multilayer printed circuit board (PCB) stacks. The design is demonstrated with a three (five) section divider, which occupies less than 5 mm2(16 mm2) of surface area. The insertion loss is below 3.8 dB (4.7 dB) from 1 to 40 GHz, while all ports exhibit more than 10 dB match. The isolation exceeds 10 dB above 6 GHz (2.5 GHz).en
dc.language.isoende_DE
dc.relation.ispartof2018 48th European Microwave Conference, EuMC 2018de_DE
dc.titleCompact Ultra-Broadband Power Dividers with Integrated Resistorsde_DE
dc.typeinProceedingsde_DE
dc.identifier.urnurn:nbn:de:gbv:830-882.028048-
dc.type.dinicontributionToPeriodical-
dcterms.DCMITypeText-
tuhh.identifier.urnurn:nbn:de:gbv:830-882.028048-
tuhh.abstract.english© 2018 European Microwave Association. This paper describes the development of ultra-broadband compact power dividers for the frequency range from 2 to 40 GHz. A multi-section approach with reduced line lengths of the successive sections is used to achieve this large bandwidth at a minimal size. The resistors needed for an acceptable isolation are manufactured by lithographically structuring a conductive paste on top of microstrip lines. Thus, the entire device is planar and enables the integration in multilayer printed circuit board (PCB) stacks. The design is demonstrated with a three (five) section divider, which occupies less than 5 mm2(16 mm2) of surface area. The insertion loss is below 3.8 dB (4.7 dB) from 1 to 40 GHz, while all ports exhibit more than 10 dB match. The isolation exceeds 10 dB above 6 GHz (2.5 GHz).de_DE
tuhh.publisher.doi10.23919/EuMC.2018.8541600-
tuhh.publication.instituteHochfrequenztechnik E-3de_DE
tuhh.type.opusInProceedings (Aufsatz / Paper einer Konferenz etc.)-
tuhh.institute.germanHochfrequenztechnik E-3de
tuhh.institute.englishHochfrequenztechnik E-3de_DE
tuhh.gvk.hasppnfalse-
dc.type.drivercontributionToPeriodical-
dc.type.casraiConference Paper-
tuhh.container.startpage620de_DE
tuhh.container.endpage623de_DE
dc.relation.conference48th European Microwave Conference, EuMC 2018de_DE
item.fulltextNo Fulltext-
item.creatorOrcidDeutschmann, Björn-
item.creatorOrcidJacob, Arne-
item.creatorGNDDeutschmann, Björn-
item.creatorGNDJacob, Arne-
item.grantfulltextnone-
crisitem.author.deptHochfrequenztechnik E-3-
crisitem.author.deptHochfrequenztechnik E-3-
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