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Item type:Publication, Access status: without files , On the choice of huygens' surfaces in the vicinity of electrically small apertures(2016-11-08); ; ; This paper provides numerically calculated results of electric and magnetic currents on Huygens' surfaces in the vicinity of electrically small apertures. It is the aim to specify Huygens' surfaces in a way such that equivalent currents can be approximated by a tenth of a wavelength discretization with sufficient accuracy. This problem is investigated in the framework of the method of moments using Rao-Wilton-Glisson basis functions. The analysis is carried out for an infinite screen with a finite number of apertures, an infinite screen with periodic apertures, and a finite cavity with an aperture array in its front panel.Publicationtype: Conference Paper77 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , Modeling of differential striplines in segmented simulation of printed circuit board linksThe decomposition, i.e., segmentation, of multilayer printed circuit board links into constitutive parts by means of network parameter representations is widely accepted. This work examines implications of this procedure regarding differential links. For the first time, the physics-based single-ended stripline port is generalized to model coupled striplines in the environment of multilayer PCBs. Notably, results are general in nature and are not limited to the employed methods. The proposed approach allows for segmentation and computationally efficient simulation of links between very large via pin fields, where differential stripline pairs pose a common routing scheme. Its feasibility is validated using self-contained physics-based simulations as well as measurements and full-wave simulation results up to 40 GHz.Publicationtype: Conference Paper137 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , Crosstalk between wire pairs above a composite ground planeCrosstalk between two wire pairs in three different configurations is compared to investigate the influence of replacing aluminium by carbon-fibre-reinforced plastic composite material in ground returns. Measurements and simulations show the same interesting effect involving a transition frequency at which the influence of the composite ground plane changes. For low frequencies it acts as a transparent layer on crosstalk behaviour, whereas for higher frequencies it can significantly decrease crosstalk levels. This phenomenon can be explained physically by investigating the skin effect of the composite ground plane. Reverse engineering can even lead to an estimation of the conductivity of the composite material when a crosstalk measurement is at hand.Publicationtype: Conference Paper98 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , Design space exploration for printed circuit board vias using polynomial chaos expansionThis work discusses how the Williamson equivalent circuit for the modeling of via transitions is augmented using the polynomial chaos expansion (PCE) method to take into account stochastic variations of model parameters. In addition, it is shown how the PCE can be applied in combination with Monte-Carlo (MC) sampling to conduct an efficient design space analysis. The physics-based via (PBV) model is used to efficiently model multilayer via interconnects by concatenating equivalent circuit models representing certain geometric sections of the interconnect. These equivalent circuits are expanded with respect to the stochastic model parameters by means of PCE and concatenated to derive an augmented model of the whole interconnect. From this representation, stochastic scattering parameters are extracted. Numerical examples verify the method and the computational advantages over MC sampling. The method provides a fast and comprehensive approach to design space exploration and variability assessment in the design stage of via interconnects. The presented approach is not limited to via models and can be applied to various microwave structures in a similar way.Publicationtype: Conference Paper92