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    Item type:Publication, Access status: without files ,
    Six-Port technology for precise geometrical measurement applications - An overview
    (2013-10)
    Kölpin, Alexander
    ;
    Vinci, Gabor
    ;
    Lindner, Stefan
    ;
    Mann, Sebastian
    ;
    Barbon, Francesco
    Instrumentation for precise geometrical measurements based on radar technology get more and more important for industrial applications. Besides distance, determining an angle or modal analysis of vibrations are key issues for automation in modern fabrication. Industrial applications put high demands on the measurement systems, not only regarding precision but also concerning operation in harsh environments and low cost implementations. In the last years Six-Port technology got more and more important for these applications. This paper will give an overview of Six-Port technique for geometrical distance measurements.
    Publicationtype: Conference Paper
      91
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    Item type:Publication, Access status: without files ,
    Evaluation of a microwave based contact-free testing method for mechanical sensitivity analysis of MEMS for inline integration of on-wafer measurements
    (2013-10)
    Oesterle, Florian
    ;
    Gardill, Markus
    ;
    Weigel, Robert
    ;
    Kölpin, Alexander
    Testing of Micro Electro Mechanical Systems is a key issue in high volume batch manufacturing. Deviating process parameters influence the nominal intrinsic stress level of the mechanical components, leading to a variation of the specified sensitivity, hence the system functionality. Focusing on a short test time, inline integration, and contactless excitation and analysis methods, establishing an electrical test for the required sensitivity within the mechanical domain is challenging. Depending on the design and functionality of the specific MEMS device, optical interferometry methods, Impedance or Network Analyzers or even final system level tests are implemented nowadays. This paper presents an alternative contactless testing method for sensitivity analysis of MEMS using microwave reflectometry. Proving the enormous potential of the method for inline integration, measurement results for varying chuck thickness and frequencies within the W-band are shown and evaluated, using a dedicated test setup for on-chip or on-wafer measurements.
    Publicationtype: Conference Paper
      52
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    Item type:Publication, Access status: without files ,
    Electromagnetic field analysis with advanced structural modeling of microstrips on porosified LTCC
    (2013-10)
    Talai, Armin
    ;
    Weigel, Robert
    ;
    Kölpin, Alexander
    ;
    Gmeiner, Björn
    ;
    Rude, Ulrich
    Recent investigations demonstrated that porosification offers the possibility of high quality antenna integration on LTCC by local reduction of the relative permittivity. In order to take advantage of this technology, further research for the deposition of conductors on porosified areas has to be done. Since the near-surface material removal is strong, conductors are expected to penetrate substantially into the porosified substrate. In this paper a new, randomized structural modeling technique of porosified LTCC is presented, which is based on scanning electron microscope imaging. Finite 3D field simulations, performed with this model, show the electromagnetic effects of different vertical microstrip positions on the effective permittivity and the corresponding scattering parameters.
    Publicationtype: Conference Paper
      77