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    Item type:Publication,
    Model for the voltage and temperature dependence of the soft breakdown current in ultrathin gate oxides
    (American Institute of Physics (AIP), 2005) ; ; ;
    The voltage and temperature dependence of the soft breakdown conduction mechanism in metal-oxide-semiconductor capacitors and transistors with ultrathin dielectric layers is investigated. A physical derivation of the quantum point contact model and its parameters is presented, which incorporates the smearing of the Fermi function at the electrodes as well as the effect of thermal vibrations of the constriction's bottleneck. The model also takes into account the boundary conditions at the two ends of the breakdown path by considering the semiconductor band bending occurring in the nondamaged surrounding device area. Good agreement between model and experimental curves is found. Because of its analytical nature, the proposed model can be implemented in circuit simulators. © 2005 American Institute of Physics.
    Publicationtype: Journal Article
      24
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    Consistent model for the voltage and temperature dependence of the soft breakdown conduction mechanism in ultrathin gate oxides
    The voltage and temperature dependence of the soft breakdown conduction mechanism in ultrathin gate oxides in MOS structures was investigated. Measurements performed on p- and n-type substrate samples with different oxide thicknesses were compared, and the results analyzed within the framework of the quantum point contact model for dielectric breakdown. The model has been extended so as to include the thermal vibrations of the atoms that form the constriction's bottleneck. A new interpretation of the model parameters, in connection with the potential drops distribution, is discussed.
    Publicationtype: Journal Article
      6
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    Item type:Publication,
    Experimental study and modeling of the temperature dependence of soft breakdown conduction in ultrathin gate oxides
    In this work, we focus our interest on the temperature dependence of soft breakdown conduction (SBD), mainly in the range in which real devices are commonly operated (-20°C<T<160°C). A thorough experimental study involving samples with different oxide thicknesses and substrate types is presented, and the results are interpreted in terms of an extended version of the quantum point contact model (QPC) for the non-zero temperature case. Even though several approaches attempting to explain the SBD I-V characteristics have been proposed, analytical modeling of its temperature dependence has always been restricted to a single bias condition. In contrast, we provide a simple parameterization of the experimental data which accounts for both I-V and I-T characteristics within a consistent framework based on the physics of mesoscopic conductors. The magnitude of the current flowing through the SBD spot essentially depends on the barrier height encountered by incoming electrons, while the shape of the I-V characteristics is dictated by the particular features of the spot and the potential drop distribution.
    Publicationtype: Conference Paper
      11
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    Temperature dependence of the hard breakdown current of MOS capacitors
    I-V curves as a function of temperature of broken down n- and p-type MOS capacitors with different oxide thicknesses are presented. In accumulation, a crossover of the temperature dependent curves is observed. At low voltages the hard breakdown current increases with temperature whereas it decreases with temperature for higher voltages. This behaviour can be straightforwardly linked to the available charge for conduction at the electrodes. MINIMOS simulations as well as theoretical considerations were performed that clearly support this idea.
    Publicationtype: Conference Paper
      12