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Item type:Publication, Access status: with files , Receiver components and frontends for wideband communications at W-band(2024); This work deals with the development of a dual-polarized receiver array operating at Wband. The passive components are designed based on the requirements of three different application scenarios targeting data rates up to 100 Gbit/s. The main challenges are small geometries combined with manufacturing tolerances and the large bandwidth to be covered. Finally, all components are assembled into an active dual-polarized 2x2 antenna array, which is characterized in its far-field properties. The measurement results confirm a successful system integration.Publicationtype: Doctoral Thesis56 92 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , A Compact K-/Ka-Band Waveguide Transition with Integrated Diplexer and Power Divider(2021-04); ; ; ; The component presented in this work combines three functionalities, i.e., a waveguide transition, frequency separation, and power division. A rectangular waveguide (RWG) serves as common 20/30 GHz port. The signals are diplexed into two 20 GHz and four 30 GHz grounded coplanar waveguides (GCPWs). The required 3 dB and 6 dB power division ratios are achieved reactively and by exploiting symmetries. Both passbands feature a -10 dB reflection bandwidth of more than 1.2 GHz, an insertion loss below 1.3 dB, an isolation exceeding 25 dB, and an amplitude imbalance of less than 1 dB. The component occupies only 9 x 9 mm2 on a single layer printed circuit board (PCB) and is thus suitable for application in highly integrated phased array front-ends.Publicationtype: Conference Paper43 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , A W-Band chip-to-printed circuit board interconnect(2020-08); An alternative to wire-bonding and flip-chip interconnects of integrated circuits and printed circuit boards (PCB) is presented. The flip-line interconnect combines the advantages of wire-bonding and flip-chip technology while avoiding their disadvantages. It is especially useful for prototype setups where device inspection and repairability are crucial. The proposed structure is analyzed using full-wave simulation software. It is shown, that in contrast to wire-bonding, the transition length is not critical. A transition from a CMOS chip with a pad pitch of 100 μm to a regular PCB is manufactured. Measurements at W-band (75-110 GHz) reveal a return loss better than 12 dB and transmission above -3.4 dB.Publicationtype: Conference Paper126 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , Broadband Septum Polarizer With Triangular Common Port(2020-02); This article presents a novel broadband septum polarizer with a relative bandwidth (BW) of 37.8%. This is significantly more than the approximate 25% BW of square and circular waveguide polarizers. It is enabled by using an equilateral triangular common port waveguide, which guarantees the largest possible frequency range between fundamental and next higher order mode cutoff. The transition between the triangular section and the rectangular input waveguides, which includes the septum, is designed to accommodate this large BW. The simulation is validated using a polarizer designed for 75–110 GHz and fabricated by conventional precision milling. A second polarizer is realized for the 18-to-26 GHz range by employing additive manufacturing to demonstrate the advantages of this technology in this context. In both cases, the axial ratio remains below 1.3 dB, whereas the input port isolation and the input return loss exceed 17 and 15 dB, respectively.Publicationtype: Journal Article171 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , PolyData/DataRace -- Polymer-Integrated CMOS-Based High-Speed Communication Systems at W-BandPublicationtype: Book Part168 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , A Fully Differential Ultra-Broadband Power Divider with Integrated Resistors(2019-10); ; A fully differential power divider with ultra-broadband performance is presented. It consists of multi-section Wilkinson power combiners vertically aligned in a multilayer circuit board, which are fed by differential via transitions. The carbon paste decoupling resistors are integrated in the stack. The measured differential-mode output isolation exceeds 10 dB above 2.9 GHz. The excess insertion loss remains below 1.0 dB up to 21 GHz and reaches 2.0 dB at 36.5 GHz. The structure, which is designed for compactness, occupies only 50 mm2 .Publicationtype: Conference Paper379 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , A Full W-Band Waveguide-to-Differential Microstrip Transition(2019-06); A vertical transition from differential microstrip line to WR10 rectangular waveguide is presented. In contrast to other approaches, it does not necessitate a backside cavity. This simplifies the integration into multilayer circuits. The measured response which agrees well with the simulated one demonstrates a good performance over the entire W-Band. The insertion loss ranges from 0.5dB to 1.1dB whereas the return loss is better than 13dB over the whole bandwidth of 37.8%.Publicationtype: Conference Paper307 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , Compact Ultra-Broadband Power Dividers with Integrated Resistors(2018-11-20); This paper describes the development of ultra-broadband compact power dividers for the frequency range from 2 to 40 GHz. A multi-section approach with reduced line lengths of the successive sections is used to achieve this large bandwidth at a minimal size. The resistors needed for an acceptable isolation are manufactured by lithographically structuring a conductive paste on top of microstrip lines. Thus, the entire device is planar and enables the integration in multilayer printed circuit board (PCB) stacks. The design is demonstrated with a three (five) section divider, which occupies less than 5 mm2(16 mm2) of surface area. The insertion loss is below 3.8 dB (4.7 dB) from 1 to 40 GHz, while all ports exhibit more than 10 dB match. The isolation exceeds 10 dB above 6 GHz (2.5 GHz).Publicationtype: Conference Paper156